Semiconductor element, semiconductor device and methods for manufacturing thereof

ABSTRACT

The present invention provides a method of manufacturing a semiconductor element having a miniaturized structure and a semiconductor device in which the semiconductor element having a miniaturized structure is integrated highly, by overcoming reduction of the yield caused by alignment accuracy, accuracy of a processing technique by reduced projection exposure, a finished dimension of a resist mask, an etching technique and the like. An insulating film covering a gate electrode is formed, and a source region and a drain region are exposed, a conductive film is formed thereover, a resist having a different film thickness is formed by applying the resist over the conductive film, the entire surface of the resist is exposed to light and developed, or the entire surface of the resist is etched to form a resist mask, and the conductive film is etched by using the resist mask to form a source and drain electrode.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor element having aminiaturized structure, for example a transistor, particularly afield-effect type of transistor, typically a MOS (Metal OxideSemiconductor) transistor (hereinafter, MOSFET) and a thin filmtransistor (TFT), and also relates to a method for manufacturing thesame, and a method for manufacturing a semiconductor device comprisingthe semiconductor element having a miniaturized structure.

2. Description of the Related Art

In recent years, a demand for downsizing, lightweight, low-cost isincreasing more and more in an electric appliance containing asemiconductor device (e.g., a video camera, a digital camera, aprojector, a personal computer, a mobile computer, a mobile phone, andan electronic book). It is natural for users to demand for betterperformance if the electric appliance is downsized and lightened, andthe better performance than that of current one is being demanded in theelectric appliance. A function and the performance of the electricappliance depend on characteristics of LSI which constitutes a systemand characteristics of a display device in a display portion of theelectric appliance. Accordingly, research and development onminiaturization and high-integration concerning the semiconductor devicesuch as LSI and on brightness and high-definition of a display device isbeing actively done. By improving the degree of the miniaturization andthe integration, the more functions can be mounted on one chip, whichpermits the above-described demand for the downsizing, the lightweightand the high performance of the electric appliance to be satisfied. Ahigh-definition image display can be realized by increasing the numberof pixels in the display device.

For example, a system-on-chip is proposed, in which circuits such as anMPU, a memory, and an I/O interface constituting a system (functioncircuit) are mounted on one chip in monolithic and which can realizehigh speed, high reliability, and low electrical power consumption.Further, a system-on-panel that the above system (functional circuit) isformed by using TFTs and formed (mounted) on the same substrate as adisplay panel, is also proposed. Technology development ofhigh-integration has been done in order to realize the purposes. It isnecessary to manufacture a TFT having a high switching speed for thesake of manufacturing the above described system (function circuit) byusing the TFTs. Accordingly, miniaturization of a TFT element as well asenhancing crystallinity of a semiconductor region of a TFT is requiredmore and more, and an attempt to reduce a size of each part (a wiringwidth, a channel width, a diameter of a contact hole, and the like) of asemiconductor element is made.

It is not too much to say that a processing technique and an etchingtechnique by alignment control and reduced projection exposure determinethe miniaturization level for high-integration and miniaturization ofthe semiconductor device.

A manufacturing step of a semiconductor element, a TFT as arepresentative example, is shown in FIGS. 7A to 7C. A base film 702 isformed on a substrate 701, a semiconductor region 703 is formed thereon,and a gate insulating film 704 is formed thereover. Then, a conductivefilm is formed over the gate insulating film, and this conductive filmis etched to form a gate electrode 705. After that, impurities are dopedinto the semiconductor region by using the gate electrode 705 as a mask,and activated to form a source region 703 a, a drain region 703 b, and achannel forming region 703 c. An insulating film is formed thereover asan interlayer insulating film 706. Then, a resist (not shown) isapplied, and the resist is exposed to light and developed to form resistmasks 708 a to 708 c. Etching is performed by using the resist masks 708a to 708 c as etching masks so as to form contact holes 707 a and 707 bto connect with the source region 703 a and the drain region 703 b ofthe semiconductor region.

A source electrode 709 a and a drain electrode 709 b are formed in thecontact holes 707 a and 707 b to form a TFT as shown in FIG. 7B.

There is a problem that a gate electrode 715 and a source electrode 719a or a drain electrode 719 b short-circuit, as shown in FIG. 7C, due tomisalignment of a photomask when the resist masks 708 a to 708 c areformed, in a manufacturing step of a semiconductor element,particularly, a semiconductor element having a miniaturized structure.When the electrodes short-circuit, the semiconductor element can notoperate normally, and thus, the yield of a semiconductor device havingthe semiconductor element decreases.

For the sake of avoiding this problem, when a contact hole is formed, itis necessary to precisely control alignment accuracy in a light-exposurestep for forming a resist mask, accuracy of processing technique byreduced projection exposure, a finished dimension of a resist maskformed after developing of the resist, an etching amount of lateraldirection when an interlayer insulating film is etched to form a contacthole, and the like, and therefore, this makes it extremely difficult tomanufacture a semiconductor device.

When, as shown in FIG. 7B, when a semiconductor element, in particular,a TFT is designed, a margin “A” to assure a connection of the sourceregion 703 a and the drain region 703 b, and the source electrode 709 aand the drain electrode 709 b is considered, and the size of thesemiconductor region “B” is designed greater than a desired size (B-4A).Therefore, the area of the TFT increases, thereby inhibitinghigh-integration.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a method ofmanufacturing a semiconductor element having a miniaturized structureand a semiconductor device in which the semiconductor element having aminiaturized structure is integrated highly by overcoming reduction ofthe yield caused by alignment accuracy, accuracy of a processingtechnique by reduced projection exposure, a finished dimension of aresist mask, an etching technique and the like.

According to the present invention, an insulating film covering a sideof a gate electrode is formed, a contact portion is formed outside ofthe insulating film, and a semiconductor element is formed, in thesemiconductor element having a semiconductor region, a gate electrode,the gate insulating film, and the contact portion for connecting thesemiconductor region to external wirings.

According to the present invention, an insulating film covering a gateelectrode is formed, and a source region and a drain region are exposed,a conductive film is formed thereover, a resist having a different filmthickness is formed by applying the resist over the conductive film, theentire surface of the resist is exposed to light and developed, or theentire surface of the resist is etched to form a resist mask, and theconductive film is etched by using the resist mask to form a sourceelectrode and a drain electrode, in a method of manufacturing asemiconductor element having a miniaturized structure.

According to the present invention, it is possible to manufacture asemiconductor element having a miniaturized structure with the highyield, regardless of alignment accuracy of the photomask, accuracy of aprocessing technique by reduced projection exposure, since a base ofresist has a convex shape and a resist is partially different in filmthickness, and thus, a resist mask can be formed without the photomask.

According to the present invention, an insulating film covering a gateelectrode of a semiconductor element is formed, and the gate electrodeand a source and drain electrode are formed with the insulating filmtherebetween.

According to the present invention, a channel forming region of thesemiconductor region is adjacent (close) to the contact portion, in thesemiconductor element having the semiconductor region, the gateelectrode, the gate insulating film, and the contact portion forconnecting the semiconductor region to external wirings.

As the result thereof, the distance between the channel forming regionand the contact portion becomes short, the resistance generatedtherebetween is reduced, electric charges in the channel forming regioneasily move, and high-speed operation of the semiconductor element canbe obtained because the mobility is enhanced.

The present invention includes structures to be described hereinafter.

According to the present invention, a method for manufacturing asemiconductor element, comprises the steps of: forming a gate insulatingfilm, a gate electrode, and an insulating film covering the gateelectrode over a semiconductor region, forming a conductive film afterexposing a part of the semiconductor region, forming a resist mask afterapplying a resist over the conductive film, etching a part of theconductive film by using the resist mask, and etching a part of theetched conductive film or a part of the etched conductive film and apart of the semiconductor region.

According to the present invention, a method for manufacturing asemiconductor element, comprises the steps of: forming a gate insulatingfilm, a gate electrode, and an insulating film covering the gateelectrode over a semiconductor region, forming a conductive film afterexposing a part of the semiconductor region, etching a part of theconductive film or a part of the etched conductive film and a part ofthe semiconductor region, forming a resist mask after applying a resistover the conductive film, and etching a part of the conductive film byusing the resist mask.

According to the present invention, a method for manufacturing asemiconductor element, comprises the steps of: forming a firstinsulating film, a first conductive film, and a second insulating filmover a semiconductor region, forming a hard mask by etching the secondinsulating film, etching the first conductive film by using the hardmask as a mask to form a gate electrode, and then, forming a thirdinsulating film, etching the third insulating film to form a sidewall,etching the first insulating film by using the sidewall and the hardmask as a mask to form a gate insulating film, at the same time,exposing a part of the semiconductor region, and then, forming a secondconductive film, forming a resist mask after applying a resist over thesecond conductive film, etching a part of the second conductive film byusing the resist mask as a mask, and etching a part of the etched secondconductive film or a part of the etched second conductive film and apart of the semiconductor region to form a source and drain electrode.

According to the present invention, a method for manufacturing asemiconductor element, comprises the steps of: forming a firstinsulating film, a first conductive film, and a second insulating filmover a semiconductor region, forming a hard mask by etching the secondinsulating film, forming a third insulating film after etching the firstconductive film by using the hard mask as a mask to form a gateelectrode, etching the third insulating film to form a sidewall, etchingthe first insulating film by using the sidewall and the hard mask as amask to form a gate insulating film, at the same time, exposing a partof the semiconductor region, and then, forming a second conductive film,etching a part of the second conductive film or a part of the secondconductive film and a part of the semiconductor region, forming a resistmask after applying a resist over the etched second conductive film, andetching a part of the second conductive film by using the resist mask asa mask to form a source and drain electrode.

The resist mask is formed by exposing an entire face of the resist tolight and developing, or may be formed by etching an entire face of theresist, and exposing the second conductive film or a part of the secondconductive film.

The semiconductor region is a semiconductor substrate or a semiconductorthin film. And the semiconductor substrate is a single crystal siliconsubstrate or a compound semiconductor substrate. And the semiconductorthin film is a crystalline silicon film as a representative example.

According to the present invention, a semiconductor element comprises: asemiconductor region having a source region, a drain region, and achannel forming region, a gate electrode, a gate insulating film, acontact portion for connecting the semiconductor region to a source anddrain electrode, and an insulating film covering the gate electrode,wherein the channel forming region is adjacent to the contact portion.

According to the present invention, a semiconductor element comprises: asemiconductor region having a source region, a drain region, and achannel forming region, a gate electrode, a gate insulating film, acontact portion for connecting the semiconductor region to a source anddrain electrode, and an insulating film covering the gate electrode,wherein the gate electrode and the source and gate electrode are formedwith the insulating film covering the gate electrode therebetween.

The insulating film covering the gate electrode comprises an insulatingfilm that is formed over the gate electrode and an insulating film thatis formed in a side face of the gate electrode. And the insulating filmthat is formed over the gate electrode is a hard mask as arepresentative example thereof and the insulating film that is formed ina side face of the gate electrode is a sidewall as a representativeexample thereof.

The semiconductor region is a semiconductor substrate or a semiconductorthin film. And the semiconductor substrate is a single crystal siliconsubstrate or a compound semiconductor substrate. And the semiconductorthin film is a crystalline silicon film as a representative examplethereof.

These and other objects, features and advantages of the presentinvention become more apparent upon reading of the following detaileddescription along with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

In the accompanying drawings:

FIGS. 1A to 1E show a step of manufacturing a semiconductor elementaccording to the present invention;

FIGS. 2A to 2E show a step of manufacturing a semiconductor elementaccording to the present invention;

FIGS. 3A to 3E show a step of manufacturing a semiconductor elementaccording to the present invention;

FIGS. 4A to 4E show a step of manufacturing a semiconductor elementaccording to the present invention;

FIGS. 5A and 5B show a light-exposure method employed in the presentinvention;

FIGS. 6A to 6E show a step of manufacturing a semiconductor elementaccording to the present invention;

FIGS. 7A to 7C show a step of manufacturing a conventional semiconductorelement; and

FIG. 8 shows a semiconductor device according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

Hereinafter, this embodiment mode of the present invention is describedwith reference to drawings. Note that the present invention can beimplemented with various different modes, and it is to be understoodthat various changes and modifications will be apparent to those skilledin the art, unless such changes and modifications depart from the scopeand purpose of the present invention. Therefore, the present inventionshould not be limited to this embodiment mode to be describedhereinafter.

EMBODIMENT MODE 1

FIGS. 1A to 1E each show a manufacturing step of a TFT that is one ofrepresentative examples of a semiconductor element. This embodiment modeis described with reference to FIGS. 1A to 1E.

As shown in FIG. 1A, a base film 102 is formed on a substrate 101 forblocking impurities from the substrate. Then, after forming asemiconductor region 103 made of a semiconductor film having a desiredshape, a first insulating film to serve as a gate insulating film, and afirst conductive film to serve as a gate electrode are formed. Next, thefirst conductive film is etched into a desired shape to form a gateelectrode 105. At this moment, a first insulating film 104 is etchedpartly and the film thickness thereof becomes thin. Then, a secondinsulating film 106 is formed over the entire surface of the substrate.After that, impurities are doped into the semiconductor region 103 byusing the gate electrode as a mask, and an impurity region 103 a isformed.

A glass substrate such as an alumino borosilicate glass, a bariumborosilicate glass, or an aluminosilicate glass, a quartz substrate, asapphire substrate or the like, each of which has a heat resistance to500° C. or more, is used as the substrate 101. The semiconductor film isformed by a known technique such as a reduced pressure thermal CVD, aplasma CVD, a sputtering. A semiconductor material, e.g., silicon or analloy containing mainly silicon can be used for the semiconductor film.The gate electrode may have a single layer structure or a multilayerstructure. An element selected from tantalum (Ta), tungsten (W),titanium (Ti), molybdenum (Mo), aluminum (Al), copper (Cu), chromium(Cr), or niobium (Nb), an alloy material or compound material mainlycontaining the above element, or a silver-copper-palladium alloy (AgPdCualloy) may be used for the material of the gate electrode.

Next, as shown in FIG. 1B, the second insulating film is etched. By thisstep, an insulating film 108 covering the gate electrode is formed. Notethat the insulating film 108 covering the gate electrode is formed toinsulate a source electrode and a drain electrode from a gate electrode,which are formed later. Therefore, the insulating film 108 may be formedso that at least a side of the gate electrode is covered therewith.

An insulating film containing silicon as the main component can beemployed as the second insulating film. The second insulating film isetched by performing anisotropic etching such as a reactive ion etchingmethod (hereinafter, a RIE method), or an Electron Cyclotron Resonancemethod (hereinafter, an ECR method) to form a sidewall. Instead of thisstep, a resist mask is formed and the second insulating film is etched,and thus, an insulating film covering the gate electrode may be formed.

Subsequently, an impurity element imparting an n-type or p-typeconductivity is doped into a semiconductor region by using the gateelectrode 105 and the insulating film 108 covering the gate electrode,thereby forming a high concentration impurity region 109, a lowconcentration impurity region 110 and a channel forming region 111.Then, a heat treatment, intense light irradiation, or laser lightirradiation may be conducted to activate the impurities that are addedinto the high concentration impurity region and the low concentrationimpurity region. And by removing the first insulating film over a sourceregion and a drain region by wet-etching or dry-etching, the sourceregion and the drain region are exposed to form a contact portion, andat the same time, a gate insulating film 107 is formed. Note that thehigh concentration impurity region 109 becomes a source region and adrain region.

A second conductive film 112 is formed over the entire surface of thesubstrate. At the time, the second conductive film 112 has also a convexshape, since the gate electrode 105 has a convex shape over thesubstrate.

In FIG. 1B, the second conductive film 112 has a single layer structure,but may have a multilayer structure. The second conductive film 112 isformed from an element selected from the group consisting of aluminum(Al), titanium (Ti), molybdenum (Mo), and tungsten (W), or an alloymaterial mainly containing these elements.

Next, a resist 113 is applied to the entire surface of the substrate. Atthis moment, the entire surface of the substrate becomes almost level,by applying the resist to the entire surface, although a base film ofthe resist is convex and concave. The resist that is formed over thegate electrode is thin in thickness and the resist of a region exceptthe region over the gate electrode is thick in thickness.

Next, as shown in FIG. 1C, a resist mask 114 is formed by exposing theresist to light and developing it, without a photomask.

Here, a light-exposure method used in the present invention so that aresist film is left selectively in a concave portion is described withreference to FIGS. 5A and 5B.

FIG. 5A is a cross section view showing schematically an object 20having a convex and concave shape. In FIG 5A, in consideration of theheight of the surface from a reference plane, a portion in which theobject 20 has a convex shape is denoted by reference numeral 21 and aportion in which the object 20 has a concave shape is denoted byreference numeral 22. The object 20 is covered with a resist film 23.

The distance between the surface of the object 20 and a surface of theresist film 23 in a region 21 is “b” and the distance between thesurface of the object 20 and a surface of the resist film 23 in a region22 is “a”.

Light-exposure is performed on the entire surface in such alight-exposure condition that the residual film rate of the region 21 is0 percent and the residual film rate of the region 22 is abouty1(=(a−b)/a×100) percent. A mask for forming an optical pattern such asreticle is not required for the light-exposure, and the entire surfaceis irradiated with light. Thus, a photomask is not needed.

Here, the residual film rate is expressed by a formula: the residualfilm rate (%)=a resist film thickness after developing/a resist filmthickness after applying×100. In addition, a light-exposure amount[mJ/cm²]=the intensity of irradiated light [mW/cm²]×time oflight-exposure [msec]. When the residual film rate is 0 percent, thelower limit of the light-exposure amount is expressed by E th. Theresidual film rate extremely depends upon film thickness of a resistfilm, quality of a film below the resist film, an applying condition anda development condition of the resist film, and thus, the E th alsodepends on the conditions.

Generally, as the film thickness of the resist is thicker, the E th hasa tendency to increase (the tendency is referred to as a bulk effect).The E th changes also in accordance with the reflectance of the filmbelow of the resist film, and the E th has a tendency to decrease, asthe reflectance is higher. The residual film rate of a positive typeresist film has a tendency to decrease, as the energy amount of lightreceived by the resist, namely, light amount, is larger. In thelight-exposure, the resist film receives both light that is emitted froma light-exposure apparatus and light that is reflected on the film belowthe resist film. Therefore, as the reflectance is higher, there is atendency that the resist film receives more light and the E thdecreases. The present invention actively utilizes the dependency on aresist film of the E th.

FIG. 5B schematically shows relationships between the light exposureamount and the residual film rate in the two different regions in aresist film thickness (the region 21 and the region 22). Because theresist film thickness is thicker in the region 22 than in the region 21,the E th of the region 22 (hereinafter, E th_((A))) is higher than thatof the region 21(hereinafter, E th_((B))). The residual film rate of theregion 22 is preferably set to y1 percent or more, and thus, lightirradiation may be performed with the light-exposure amount of×1[mJ/cm²]or less. The residual film rate of the region 21 is preferably set to 0percent, and thus, light irradiation may be performed with thelight-exposure amount of E th_((B)) or more. Accordingly, it is apparentthat the light irradiation may be performed with the light-exposureamount of from at least E th_((B)) [mJ/cm²] to at most×1[MJ/cm²].

As the difference between E th_((A)) and E th_((B)) is larger and thedifference between ×1 and ×2 is larger, a margin for the light-exposurecondition expands. The difference between the resist film thickness “a”in the region 22 and the resist film thickness “b” in the region 21 maybe made large to increase the difference between E th_((A)) and Eth_((B)). E th_((B)) become smaller by adjusting the resist filmthickness in applying so that resist film thickness “b” in the region 21is as thin as possible, and thus, the resist film in the region 21 iseasy to remove. Therefore, the margin of the light-exposure conditioncan be ensured adequately by adjusting the film thickness of the resistfilm.

As described above, the residual film rate can be controlled inaccordance with the light-exposure amount, and the residual film rate ofresist can be adjusted in accordance with a shape of an object to beexposed to light even in the case of irradiating the entire surface withlight. Note that it is necessary to examine the relationship between thelight-exposure amount and the residual film rate of every object to betreated beforehand, since the relationship between the light-exposureamount and the residual film rate changes depending on property ofresist (viscosity, or kinds of contained solvent or light absorbingagent), shape and material of an object to be applied with resist, or abake condition in the case of applying and development. These steps maybe performed by determining the conditions in the same way aslight-exposure condition of conventional photolithography.

A negative type resist may be used to fill a concave portion formed inan opening portion, instead of using the positive type resist describedabove. In the case of using the negative type resist, a light-exposurestep is not necessarily conducted, and a resist film may be left in theconcave portion by adjusting development time or concentration ofdevelopment solution. It should be noted that the resist film in theconcave portion can be controlled to easily remain by locally heatingonly a lower portion of the resist film from under the object to beheated and changing its quality before development.

Next, as shown in FIG. 11D, a second conductive film 115 is divided byetching the second conductive film formed over the gate electrode byusing the remained resist 114 as a mask.

Then, as shown in FIG. 1E, an insulated second conductive film 115 isetched into a desired shape and a source electrode and drain electrode116 is formed as well as insulating other TFTs. In this step, the areaof a TFT can be reduced by etching a source and drain region as well asthe second conductive film 115. Then, a third insulating film is formedover the substrate as an interlayer insulating film 117. A contact holeis formed to connect with the source and drain electrode 116, and athird conductive film to be connection wirings is formed. Thereafter, aresist mask having a desired pattern is formed over the third conductivefilm, and the conductive film is etched into a desired shape by usingthe mask to form a connection wiring 118.

A step shown in FIG. 1E (the step of etching the conductive film into adesired shape and insulating it from other TFTs) may be performedbetween the step of forming the conductive film 112 over the entiresurface of the substrate and the step of applying the resist mask 113over the entire surface of the substrate in FIG. 1B in this embodimentmode.

In the TFT formed in the embodiment mode, a resist mask having a desiredshape can be formed without using a photomask, and a source electrodeand a drain electrode can be formed by self-alignment. Thus, in a TFThaving a miniaturized structure, short-circuit of a gate electrode and asource and drain electrode due to misalignment can be prevented, therebymanufacturing a TFT with the high yield.

The area of a TFT can be reduced, since it is not necessary to expandthe area of the semiconductor region in consideration of a margin so asto ensure connection between the semiconductor region and the source anddrain electrode.

Further, in a semiconductor element formed in the present invention, agate electrode and a source and drain electrode are formed with aninsulating film 108 covering the gate electrode therebetween. Namely, itis possible to closely form a channel forming region and a source anddrain electrode under the gate electrode, and thus, to reduce theresistance therebetween. Therefore, a TFT that can operate withhigh-speed can be manufactured.

In this embodiment mode, a TFT is given as a representative example of asemiconductor element, but a FET (MOSFET) that is formed by using asilicon substrate or a SOI (Silicon On Insulator) substrate can beapplied.

It is possible to increase the number of semiconductor elements mountedper unit area of one substrate, when a semiconductor device ismanufactured by using a semiconductor element of the present invention.Thus, it is possible to manufacture semiconductor devices such as ascanning line driver circuit, a signal line driver circuit, acontroller, a CPU, a converter of an audio processing circuit, a powersupply circuit, a transmit and receive circuit, a memory, an amplifierof an audio processing circuit, or the like in a pixel portion in whichthe integration degree is enhanced. A system-on-chip or a system panelin which the above devices are formed on the same substrate can bemanufactured.

EMBODIMENT MODE 2

In this embodiment mode, a manufacturing method using another step isdescribed, in forming a resist mask used for forming a source and drainelectrode. Note that the same portions as those in Embodiment 1 areshown by the same reference numerals and further description thereof isomitted.

The state shown in FIG. 2A is obtained, as in Embodiment 1.Specifically, a base film 102, a semiconductor region including a highconcentration impurity region 109, a low concentration impurity region110 and a channel forming region 111, a gate insulating film 107, a gateelectrode 105, an insulating film 108 covering at least a side of thegate electrode are formed over a substrate 101.

As shown in FIG. 2B, a conductive film 112 is formed over the entiresurface of the substrate. At the time, the conductive film 112 has alsoa convex shape, since the gate electrode 105 has a convex shape over thesubstrate.

As shown in FIG. 2C, the conductive film is etched into a desired shapeto form a conductive film 213 that is insulated every TFT.

Next, as shown in FIG. 2D, a resist 214 is applied over the entiresurface of the substrate. At this moment, the entire surface of thesubstrate becomes almost level, by applying the resist to the entiresurface, although a base film of the resist is convex and concave.

The entire surface of the resist 214 is etched. The conductive film 213is exposed by etching and removing the resist over the gate electrode. Aresist 215 formed over a source region and a drain region partlyremains. According to the above steps, the resist mask 215 can be formedwithout a photomask.

As shown in FIG. 2E, the conductive film 213 is etched to form a sourceand drain electrode 216 by using the remained resist 215 as a mask. Aninterlayer insulating film 217 is formed over the substrate. A contacthole is formed to connect with the source and drain electrode 216 and aconductive film to be a connection wiring is formed. Thereafter, aresist mask having a desired pattern is formed over the conductive film,and the conductive film is etched into a desired shape by using the maskto form a connection wiring 218.

In the TFT formed in the embodiment mode, a resist mask having a desiredshape can be formed without using a photomask, and a source electrodeand a drain electrode can be formed by self-alignment. Thus, in a TFThaving a miniaturized structure, short-circuit of a gate electrode and asource and drain electrode due to misalignment can be prevented tomanufacture a TFT with the high yield.

The area of a TFT can be reduced, since it is not necessary to expandthe area of the semiconductor region in consideration of a margin so asto ensure a connection between the semiconductor region and the sourceand drain electrode.

Further, in a semiconductor element formed in the present invention, agate electrode and a source and drain electrode are formed with aninsulating film 108 covering the gate electrode therebetween. Namely, itis possible to closely form a channel forming region and a source anddrain electrode, and thus, to reduce the resistance therebetween.Therefore, a TFT that can operate with high-speed can be manufactured.

In this embodiment mode, a TFT is given as a representative example of asemiconductor element, but a FET (MOSFET) that is formed by using asilicon substrate can be applied.

It is possible to increase the number of semiconductor elements mountedper unit area of one substrate, when a semiconductor device ismanufactured by using a semiconductor element of the present invention.Thus, it is possible to manufacture semiconductor devices such as ascanning line driver circuit, a signal line driver circuit, acontroller, a CPU, a converter of an audio processing circuit, a powersupply circuit, a transmit and receive circuit, a memory, and anamplifier of an audio processing circuit in a pixel portion in which theintegration degree is enhanced. A system-on-chip or a system panel inwhich the above devices are formed on the same substrate can bemanufactured.

EMBODIMENTS Embodiment 1

In this embodiment, a step of manufacturing a semiconductor element overa substrate having an insulating surface, for example a glass substratein this embodiment, is described with reference to FIGS. 3A to 3E andFIGS. 4A to 4D, according to the present invention.

As shown in FIG. 3A, a base insulating film 602 is formed over the glasssubstrate (a first substrate 601). In this embodiment, the baseinsulating film has a two-layer structure in which a first siliconoxynitride film is formed to be from 50 nm to 100 nm thick by usingSiH₄, NH₃, and N₂O as reactive gases, and a second silicon oxynitridefilm is formed to be from 100 nm to 150 nm thick by using SiH₄ and N₂Oas reactive gases in laminate.

An amorphous silicon film (54 nm in thickness) is laminated by a knowntechnique such as plasma CVD, reduced pressure CVD, or sputtering.

The amorphous silicon film is crystallized by employing a knowntechnique described in Japanese Patent Laid-Open No. H8-78329. By thetechnique explained in the gazette, a metal element that promotescrystallization is selectively doped into the amorphous silicon film anda heat treatment is performed. Silicide is formed in a part of theamorphous silicon film that is in contact with the metal element thatpromotes crystallization of the semiconductor, and thus, thecrystallization progresses with the silicide as a core. Here, a heattreatment for dehydrogenation (at 450° C., for one hour) is performed,and sequentially, a heat treatment for crystallization (at temperaturesfrom 550° C. to 650° C., for from 4 to 24 hours) is performed.

Thereafter, a metal element in a crystalline silicon film is removed orthe concentration is reduced by gettering the metal element from thecrystalline silicon film. The gettering may be performed by either ofthe following methods: a method in which a gettering site is formed bydoping phosphorus, a rare gas (generally, argon), or the like into apart of the crystalline silicon film and then, a heat treatment isperformed so that the metal element is segregated; or a method in whichan amorphous silicon film or a crystalline silicon film each includingphosphorus, a rare gas, or the like is laminated over the crystallinesilicon film interposing an oxide film therebetween to serve as agettering site, and a heat treatment is performed so that the metalelement is moved to the gettering site. It is preferable that theconcentration of the impurity element, that is, a metal element, in thecrystalline silicon film after gettering be 1×10¹⁷/cm³ or less (SIMS(secondary ion mass spectrometry) measurement limit or less), andfurther preferably, 5×10¹⁶/cm³ or less when measured by ICP-MS(inductively coupled plasma mass spectrometry).

Next, the crystalline silicon film is preferably irradiated with laserlight for repairing defects left in crystal grains and increasing thedegree of crystallinity (the proportion of crystalline component in thevolume of a whole film).

The crystalline silicon film is etched to form a crystalline siliconfilm 603 having a desired shape. Then, after the surface of the siliconfilm is washed with an etchant including hydrofluoric acid, a firstinsulating film 604 mainly containing silicon that is to be a gateinsulating film is formed. The surface of the first insulating film 604is washed, and then, a first conductive film 605, a second conductivefilm 606 and a second insulating film 607 (from 500 nm to 1000 nm inthickness) are sequentially formed. In this embodiment, a tantalumnitride film is formed as the first conductive film, a tungsten film isformed as the second conductive film and a silicon nitride oxide film isformed as the second insulating film.

Next, the second insulating film 607 is etched to have the almost samewidth as the gate electrode width to form a hard mask 608, as shown inFIG. 3B. After that, the second conductive film (tungsten film), and thefirst conductive film (tantalum nitride film) are etched to form a gateelectrode 609 of about 1 μm long by using the hard mask 608. At thetime, the first insulating film 604 to be a gate insulating film isslightly etched (604 a).

An impurity element (such as P, As) imparting n-type or an impurityelement (such as B) imparting p-type is added into the crystallinesilicon film by using the hard mask 608 and the gate electrode 69 as amask, thereby forming impurity regions 603 a and 603 b. Here, phosphorusor boron is doped appropriately.

Next, as shown in FIG. 3C, a third insulating film and a fourthinsulating film are formed. A silicon oxynitride film 610 (from 20 nm to50 nm in thickness) is formed as the third insulating film, and asilicon nitride film 611 (from 50 nm to 100 nm in thickness) is formedas the fourth insulating film in this embodiment. It should be notedthat the silicon nitride film 611 is preferably a film having selectiveratio of the etching rate with respect to a fifth insulating film to beformed later, since it is formed as an etching stopper for the fifthinsulating film. The silicon oxynitride film 610 is provided in order toseparate the silicon nitride film from the crystalline silicon film.This is because it prevents deterioration of electric properties of aTFT due to a contact of the silicon nitride film and the crystallinesilicon. Note that the silicon nitride film 611 and the siliconoxynitride film 610 are not necessarily formed, depending on etchingconditions of the fifth insulating film to be formed later.

After a silicon oxynitride film (from 500 nm to 1000 nm in thickness) asthe fifth insulating film is formed over the entire surface of thesubstrate, the silicon oxynitride film is anisotropically etched by aRIE method, an ECR method, or the like to form a sidewall 612. Note thatload of an etching step is less, because the film thickness of the gateelectrode is thin in this embodiment. Further, when the height of a gateelectrode is low, a sidewall is formed with less control. However, inthis embodiment, the gate electrode 609 and the hard mask 608 arelaminated and the sidewall is formed on the side thereof. Therefore, thesidewall can be formed with good control and in less load.

Next, as shown in FIG. 3D, the fourth insulating film (silicon nitridefilm) 611 is anisotropically etched. The silicon nitride film 611 of theregion where the sidewall is not formed is etched, and thus, only asilicon nitride film 611 a covered with the sidewall is left.

An impurity element (such as P, As) imparting n-type or an impurityelement (such as B) imparting p-type is added into a crystalline siliconfilm by using the sidewall 612 and the silicon nitride film 611 a thatis etched as a mask, thereby forming a high concentration impurityregion 615. Here, phosphorus or boron is doped appropriately. The regionof the crystalline silicon film that is covered with the sidewall andthe silicon nitride film is a low concentration impurity region 613having a width of from 0.2 to 0.5 μm, preferably about 0.3 μm. Theregion of the crystalline silicon film that is covered with the gateelectrode and the hard mask is a channel forming region 614. Then, aheat treatment, intense light irradiation, or laser light irradiation isperformed in order to activate the added impurity element.

Although not shown, a contact portion for connecting with the gateelectrode 609 is formed by etching a portion of the hard mask 608, inorder that the gate electrode 609 is connected to an external wiring.

Then, the entire surface of the substrate is exposed to dry etching, andthe silicon oxynitride film 610 covering the crystalline silicon filmand an insulating film 604 a that has been etched slightly are etched toexpose a source region and a drain region, and thus, the contact portion625 is formed. At this moment, the sidewall 612 is etched partly to be612 a.

As shown in FIG. 3E, a third conductive film 617 and a fourth conductivefilm 618 are formed over the entire surface of the substrate. In thisembodiment, after forming a tantalum nitride film (from 80 nm to 120 nmin thickness) as the third conductive film, an aluminum film (from 300nm to 500 nm in thickness) is formed as the fourth conductive film.

A resist is applied over the entire surface of the substrate. Afterthat, a light-exposure is preformed under such light-exposure conditionsthat only resist (a convex portion) over the gate electrode is exposedto light, and then, is developed, as shown in Embodiment Mode 1. By suchconditions, a resist 620 remains over a source and drain region 615 (aconcave portion). After that, ashing may be performed to set the linewidth of the resist to an arbitrary value (FIG. 4A).

As shown in FIG. 4B, the third conductive film 618 and the fourthconductive film 617 are removed by wet-etching or dry-etching with aresist mask 620, thereby forming a conductive film 621 that is dividedover the gate electrode.

Next, as shown in FIG. 4C, a divided conductive film 621 is etched, anda source and drain electrode 622 is formed. In the etching, the sourceand drain region 615 of the crystalline silicon film is etched, therebyforming a thin film transistor that occupies a smaller area. FIG. 4Eshows the TFT of this case. In the TFT, an edge of a source and drainregion 631 that is etched is lined up with an edge of a source and drainelectrode 632. As a result, it is possible to mount more TFTs per unitarea of one substrate, and thus, high integration is possible.

Next, a sixth insulating film is formed over the substrate, as shown inFIG. 4D, which serves as an interlayer insulating film 623. In thisembodiment, a silicon nitride oxide film is formed as the interlayerinsulating film. Then, a contact hole is formed to connect with thesource and drain electrode 622 and then, a fifth conductive film to be aconnection wiring is formed. Thereafter, a resist mask having a desiredpattern is formed over the fifth conductive film, and the conductivefilm is etched into a desired pattern by using the mask to form aconnection wiring 624.

Note that the manufacturing steps of embodiment mode 2 can be alsoadapted, although the manufacturing steps of embodiment mode 1 isemployed in this embodiment.

In the TFT formed in the embodiment mode, a resist mask having a desiredshape can be formed without using a photomask, and a source and drainelectrode can be formed by self-alignment. Thus, in a TFT having aminiaturized structure, short-circuit of a gate electrode and a sourceand drain electrode due to misalignment can be prevented to manufacturea TFT with the high yield.

The area of a TFT can be reduced, since it is not necessary to expandthe area of a semiconductor region in consideration of a margin so as toensure a connection between the semiconductor region and the source anddrain electrode.

Further, in a semiconductor element formed in the present invention, thegate electrode and the source and drain electrode are formed with aninsulating film 612 covering the gate electrode therebetween. Namely, itis possible to closely form the channel forming region and the sourceand drain electrode that are formed under the gate electrode, and thus,to reduce the resistance therebetween. Therefore, a TFT that can operatewith high-speed can be manufactured.

A semiconductor device such as a scanning line driver circuit, a signalline driver circuit, a controller, a CPU, or a converter of an audioprocessing circuit in a pixel portion can be manufactured according tothis embodiment. A system-on-panel that is small and that can displayhigh-definition images can be manufactured by providing a liquid crystaldisplay device or an EL (electroluminescence) display device for thepixel portion by a known technique, in addition to forming a system(function circuit).

Embodiment 2

A step of manufacturing a semiconductor element using a semiconductorsubstrate, according to the present invention, is described withreference to FIGS. 6A to 6E in this embodiment. Note that thesemiconductor substrate is a single crystal silicon substrate or acompound semiconductor substrate, representatively, an n-type or ap-type single crystal silicon substrate, a GaAs substrate, an InPsubstrate, a GaN substrate, a SiC substrate or a ZnSe substrate.

As shown in FIG. 6A, a p-type semiconductor substrate 301 made of singlecrystal silicon is provided, for example, a p-type well 302 and ann-type well 303 are provided for the semiconductor substrate, and then,a field insulating film 304 for separating elements, which is made of asilicon oxide film having a LOCOS (Local Oxidation of Silicon)structure, is formed by thermally oxidizing a selective region of thesurface of the semiconductor substrate 301.

Next, the surface of the semiconductor substrate 301 is thermallyoxidized to form a silicon oxide film (gate insulating film) 305 that isa thin film and is about 50 nm or less. And a polycrystalline siliconfilm of around 300 nm in thickness is deposited over the silicon oxidefilm 305 by CVD.

Next, a silicon oxide film of around 50 nm in thickness is formed by CVDso that a hard mask for forming a gate electrode is formed over thesemiconductor substrate 301. After that, a resist is applied over thesilicon oxide film and light-exposure and development are performedusing a photomask to form a resist mask having a shape of the gateelectrode.

The silicon oxide film is dry-etched to form a hard mask 306 using theresist mask. Then, the resist mask is removed and the polycrystallinesilicon film is etched to form a gate electrode 307 by using the hardmask as a mask for the etching. Note that the polycrystalline siliconfilm has higher etching rate than the silicon oxide film of the gateinsulating film, and thus, only the polycrystalline silicon film can beselectively etched. Alternatively, the resist mask is not removed andthe gate electrode 307 may be formed by using the resist mask and thehard mask as a mask for etching.

After a silicon oxide film is deposited by CVD over the semiconductorsubstrate 301, the silicon oxide film is etched by a RIE method, an ECRmethod, or the like to form a sidewall 308.

Ion-implantation of an impurity element imparting n-type such asphosphorous is performed on the p-type well 302 over the semiconductorsubstrate 301 to form an n-type semiconductor region 309 to be a sourceand a drain. And, ion-implantation of an impurity element impartingp-type such as boron is performed on the n-type well 303 over thesemiconductor substrate 301 to form a p-type semiconductor region 310 tobe a source and a drain.

As shown in FIG. 6B, the silicon oxide film 305, which is formed overthe n-type semiconductor region 309 to be a source or a drain and thep-type semiconductor region 310 to be a source and a drain, is removedto form a gate insulating film 311. Thereafter, the hard mask may beetched back to expose the gate electrode.

A high-melting point metal film such as a titanium film, a tungstenfilm, a molybdenum film, a cobalt film, a nickel film is formed over thesemiconductor substrate 301 by sputtering. In this embodiment, atitanium film 312 is formed, and then, a silicon high-melting pointmetal film 313 is formed by a heat treatment in a region where thehigh-melting point metal film is in contact with a silicon region. Afterthat, a conductive film, for example, an aluminum film 314 is formed bysputtering. At this time, the gate electrode and the like are formedover the semiconductor substrate, and thus, the surface of the aluminumfilm is convex and concave.

A resist is applied to the semiconductor substrate 301. At the time, theresist has a thin film thickness over the gate electrode and arelatively thick film thickness in other regions. Then, the entire faceof the resist is exposed to light as in Embodiment Mode 1, and then, isdeveloped to form resist masks 315 a, 315 b, and 315 c (FIG. 6C).

As shown in FIG. 6D, the aluminum film and the titanium film arewet-etched by using the resist masks 315 a, 315 b, and 315 c as etchingmasks to remove the aluminum film and the titanium film over the gateelectrode, thereby forming an aluminum film and a titanium film 316 a,316 b, and 316 c that each are separated. It should be noted that thegate electrode is not etched, since the hard mask serves as an etchingstopper due to the difference in etching rate, in the case where thehard mask 306 is formed over the gate electrode 307.

As shown in FIG. 6E, source and drain electrodes 317 and 318 of eachelement are formed. An insulating film is formed and then, an interlayerinsulating film 319 is formed by leveling the insulating film. Afterthat, a contact hole is formed to connect with the source and drainelectrodes 317 and 318, and a conductive film to be a connection wiringis formed. Thereafter, a resist mask having a desired pattern is formedover the conductive film, and the conductive film is etched into adesired shape by using the mask to form connection wirings 320 and 321.In this embodiment, an aluminum film is formed as the conductive film.Note that the leveling step is not needed in the case where an SiO_(x)film, a PSG (phosphorous silicate glass) film, a BSG (boron silicateglass) film, or a SOG (Spin On Glass) of a BPSG (boron phosphoroussilicate glass) film, which are each formed by spin-coating, is used forthe interlayer insulating film 319. However, in this case, since a heattreatment step is necessary, a film made of a high-melting point metalsuch as tungsten, titanium, molybdenum, cobalt, or nickel is formed forthe source and drain electrodes 317 and 318.

Note that the manufacturing step of embodiment mode 2 can be alsoemployed, although the manufacturing step of embodiment mode 1 isemployed in this embodiment.

In the MOSFET formed in the embodiment mode, a resist mask having adesired shape can be formed without using a photomask, and a source anddrain electrode can be formed by self-alignment. Thus, in a MOSFEThaving a miniaturized structure, short-circuit of a gate electrode and asource and drain electrode due to misalignment can be prevented tomanufacture a MOSFET with the high yield.

The area of a MOSFET can be reduced, since it is not necessary to expandthe space of a semiconductor element in consideration of a margin so asto ensure a connection between the semiconductor region and the sourceand drain electrode.

Further, in a semiconductor element formed according to the presentinvention, a gate electrode and a source and drain electrode are formedwith a sidewall 308 therebetween. Namely, it is possible to closely forma source electrode and a drain electrode that are formed under the gateelectrode, and thus, to reduce the resistance therebetween. Therefore, aMOSFET that can operate with high-speed can be manufactured.

According to this embodiment, it is possible to manufacture asemiconductor device such as a scanning line driver circuit, a signalline driver circuit, a controller, a CPU, a converter of an audioprocessing circuit, a power supply circuit, a transmit and receivecircuit, a memory, or an amplifier of an audio processing circuit in apixel portion in which the integration degree is enhanced. Further, asystem-on-chip can be manufactured, in which circuits such as an MPU(microcomputer), a memory, and an I/O interface constituting a system(function circuit) are mounted on one chip in monolithic, and which canrealize high speed, high reliability, and low electrical powerconsumption.

Embodiment 3

One example of a system-on-chip that is a representative semiconductorelement manufactured according to Embodiment Modes 1 and 2 is describedwith reference to FIG. 8. As shown in FIG. 8, various kinds of functioncircuit portions are integrated on a single crystal silicon substrate,thereby realizing a system-on-chip. Various kinds of function circuitportions can be formed by mainly using a semiconductor element such asMOSFET or a capacitor portion manufactured according to Embodiment Mode1 or 2. Note that a semiconductor device like one in this embodiment canbe formed by using a semiconductor element such a TFT or a capacitorelement manufactured according to Embodiment Mode 1 or 2, by using asubstrate having an insulating surface (typically, a glass substrate) asthe substrate.

A CPU 1701, a ROM 1702, an interrupt controller 1703, a cache memory1704, a RAM 1705, a DMAC 1706, a clock generation circuit 1707, a serialinterface 1708, a power supply generation circuit 1709, a ADC/DAC 1710,a timer counter 1711, a WDT 1712, an I/O port 1713 and the like areshown as elements of a system-on-chip 1700 shown in FIG. 8.

A semiconductor device such as MPU (a microcomputer), a media processor,a graphics LSI, a cryptogram LSI, a memory, a portable telephone LSI canbe manufactured by exchanging a combination or structure of variousfunctional circuits for a system-on-chip.

As for a semiconductor element manufactured according to the presentinvention, a source electrode and a drain electrode can be formed byself-alignment without using a photomask. Thus, in a miniaturizedstructure, short-circuit of a gate electrode and a source and drainelectrode due to alignment accuracy, accuracy of processing technique byreduced projection exposure, a finished dimension of a resist mask, oran etching technique, can be prevented to manufacture a semiconductorelement with the high yield.

It is not necessary to expand the area of a semiconductor region inconsideration of a margin so as to ensure a connection between thesemiconductor region and the source and drain electrode of thesemiconductor element, thereby enhancing the integration degree of asemiconductor device as well as forming a miniaturized semiconductorelement.

Further, in a semiconductor element formed according to the presentinvention, a gate electrode and a source and drain electrode are formedwith an insulating film covering the gate electrode therebetween.Namely, it is possible to closely form a channel forming region and asource and drain electrode that are formed under the gate electrode, andthus, to reduce the resistance therebetween. Therefore, a semiconductorelement and a semiconductor device that can operate with high-speed canbe manufactured.

This application is based on Japanese Patent Application serial no.2003-118731 filed in Japan Patent Office on 23 h, April, 2003, thecontents of which are hereby incorporated by reference.

Although the present invention has been fully described by way ofEmbodiment Modes and Embodiments with reference to the accompanyingdrawings, it is to be understood that various changes and modificationswill be apparent to those skilled in the art. Therefore, unlessotherwise such changes and modifications depart from the scope of thepresent invention hereinafter defined, they should be constructed asbeing included therein.

1. A method for manufacturing a semiconductor element comprising:forming a gate insulating film over a semiconductor region; forming agate electrode over the semiconductor region with the gate insulatingfilm interposed therebetween; forming an insulating film covering thegate electrode; exposing a part of the semiconductor region; forming aconductive film over the semiconductor region after exposing a part ofthe semiconductor region; forming a resist over the conductive film;removing a portion of the resist to form a resist mask; etching a partof the conductive film by using the resist mask; and etching a part ofthe etched conductive film.
 2. A method for manufacturing asemiconductor element comprising: forming a gate insulating film over asemiconductor region; forming a gate electrode over the semiconductorregion with the gate insulating film interposed therebetween; forming aninsulating film covering the gate electrode; exposing a part of thesemiconductor region; forming a conductive film over the semiconductorregion after exposing a part of the semiconductor region; forming aresist over the conductive film; removing a portion of the resist toform a resist mask; etching a part of the conductive film by using theresist mask; and etching a part of the etched conductive film and a partof the semiconductor region.
 3. A method for manufacturing asemiconductor element comprising: forming a gate insulating film over asemiconductor region; forming a gate electrode over the semiconductorregion with the gate insulating film interposed therebetween; exposing apart of the semiconductor region; forming a conductive film over thesemiconductor region after exposing a part of the semiconductor region;etching a part of the conductive film; forming a resist over theconductive film; removing a portion of the resist to form a resist mask;and etching a part of the conductive film by using the resist mask.
 4. Amethod for manufacturing a semiconductor element comprising: forming agate insulating film over a semiconductor region; forming a gateelectrode over the semiconductor region with the gate insulating filminterposed therebetween; exposing a part of the semiconductor region;forming a conductive film over the semiconductor region after exposing apart of the semiconductor region; etching a part of the conductive filmand a part of the semiconductor region; forming a resist over theconductive film; removing a portion of the resist to form a resist mask;and etching a part of the conductive film by using the resist mask.
 5. Amethod for manufacturing a semiconductor element comprising: forming afirst insulating film over a semiconductor region; forming a firstconductive film over the first insulating film; forming a secondinsulating film over the first conductive film; forming a hard mask byetching the second insulating film; etching the first conductive film byusing the hard mask as a mask to form a gate electrode; forming a thirdinsulating film over the semiconductor region; etching the thirdinsulating film to form a sidewall; etching the first insulating film byusing the sidewall and the hard mask as a mask to form a gate insulatingfilm; exposing a part of the semiconductor region; forming a secondconductive film; forming a resist over the second conductive film;removing a portion of the resist to form a resist mask; etching a partof the second conductive film by using the resist mask as a mask; andetching a part of the etched second conductive film and a part of thesemiconductor region to form a source and drain electrode.
 6. A methodfor manufacturing a semiconductor element comprising: forming a firstinsulating film over a semiconductor region; forming a first conductivefilm over the first insulating film; forming a second insulating filmover the first conductive film; forming a hard mask by etching thesecond insulating film; etching the first conductive film by using thehard mask as a mask to form a gate electrode; forming a third insulatingfilm over the semiconductor region; etching the third insulating film toform a sidewall; etching the first insulating film by using the sidewalland the hard mask as a mask to form a gate insulating film; exposing apart of the semiconductor region; forming a second conductive film;etching a part of the second conductive film; forming a resist over thesecond conductive film; removing a portion of the resist to form aresist mask; and etching a part of the second conductive film by usingthe resist mask as a mask to form a source and drain electrode.
 7. Amethod for manufacturing a semiconductor element according to claim 1,wherein the resist mask is formed by developing after exposing an entireface of the resist to light.
 8. A method for manufacturing asemiconductor element according to claim 1, wherein the resist mask isformed by etching an entire face of the resist, and exposing a part ofthe conductive film.
 9. A method for manufacturing a semiconductorelement according to claim 1, wherein the semiconductor region is asemiconductor substrate or a semiconductor thin film.
 10. A method formanufacturing a semiconductor element according to claim 9, wherein thesemiconductor substrate is a single crystal silicon substrate or acompound semiconductor substrate.
 11. A method for manufacturing asemiconductor element according to claim 9, wherein the semiconductorthin film is a crystalline silicon film.
 12. A method for manufacturinga semiconductor element according to claim 2, wherein the resist mask isformed by developing after exposing an entire face of the resist tolight.
 13. A method for manufacturing a semiconductor element accordingto claim 2, wherein the resist mask is formed by etching an entire faceof the resist, and exposing a part of the conductive film.
 14. A methodfor manufacturing a semiconductor element according to claim 2, whereinthe semiconductor region is a semiconductor substrate or a semiconductorthin film.
 15. A method for manufacturing a semiconductor elementaccording to claim 14, wherein the semiconductor substrate is a singlecrystal silicon substrate or a compound semiconductor substrate.
 16. Amethod for manufacturing a semiconductor element according to claim 14,wherein the semiconductor thin film is a crystalline silicon film.
 17. Amethod for manufacturing a semiconductor element according to claim 3,wherein the resist mask is formed by developing after exposing an entireface of the resist to light.
 18. A method for manufacturing asemiconductor element according to claim 3, wherein the resist mask isformed by etching an entire face of the resist, and exposing a part ofthe conductive film.
 19. A method for manufacturing a semiconductorelement according to claim 3, wherein the semiconductor region is asemiconductor substrate or a semiconductor thin film.
 20. A method formanufacturing a semiconductor element according to claim 19, wherein thesemiconductor substrate is a single crystal silicon substrate or acompound semiconductor substrate.
 21. A method for manufacturing asemiconductor element according to claim 19, wherein the semiconductorthin film is a crystalline silicon film.
 22. A method for manufacturinga semiconductor element according to claim 4, wherein the resist mask isformed by developing after exposing an entire face of the resist tolight.
 23. A method for manufacturing a semiconductor element accordingto claim 4, wherein the resist mask is formed by etching an entire faceof the resist, and exposing a part of the conductive film.
 24. A methodfor manufacturing a semiconductor element according to claim 4, whereinthe semiconductor region is a semiconductor substrate or a semiconductorthin film.
 25. A method for manufacturing a semiconductor elementaccording to claim 24, wherein the semiconductor substrate is a singlecrystal silicon substrate or a compound semiconductor substrate.
 26. Amethod for manufacturing a semiconductor element according to claim 24,wherein the semiconductor thin film is a crystalline silicon film.
 27. Amethod for manufacturing a semiconductor element according to claim 5,wherein the resist mask is formed by developing after exposing an entireface of the resist to light.
 28. A method for manufacturing asemiconductor element according to claim 5, wherein the resist mask isformed by etching an entire face of the resist, and exposing a part ofthe second conductive film.
 29. A method for manufacturing asemiconductor element according to claim 5, wherein the semiconductorregion is a semiconductor substrate or a semiconductor thin film.
 30. Amethod for manufacturing a semiconductor element according to claim 29,wherein the semiconductor substrate is a single crystal siliconsubstrate or a compound semiconductor substrate.
 31. A method formanufacturing a semiconductor element according to claim 29, wherein thesemiconductor thin film is a crystalline silicon film.
 32. A method formanufacturing a semiconductor element according to claim 6, wherein theresist mask is formed by developing after exposing an entire face of theresist to light.
 33. A method for manufacturing a semiconductor elementaccording to claim 6, wherein the resist mask is formed by etching anentire face of the resist, and exposing a part of the second conductivefilm.
 34. A method for manufacturing a semiconductor element accordingto claim 6, wherein the semiconductor region is a semiconductorsubstrate or a semiconductor thin film.
 35. A method for manufacturing asemiconductor element according to claim 34, wherein the semiconductorsubstrate is a single crystal silicon substrate or a compoundsemiconductor substrate.
 36. A method for manufacturing a semiconductorelement according to claim 34, wherein the semiconductor thin film is acrystalline silicon film.
 37. A semiconductor element comprising: asemiconductor region having a source region, a drain region, and achannel forming region; a gate electrode; a gate insulating film; acontact portion for connecting the semiconductor region to a source anddrain electrode; and an insulating film covering the gate electrode,wherein between the channel forming region and the contact portion isfrom 0.2 μm to 0.5 μm.
 38. A semiconductor element comprising: asemiconductor region having a source region, a drain region, and achannel forming region; a gate electrode; a gate insulating film; acontact portion for connecting the semiconductor region to a source anddrain electrode; and wherein the gate electrode and the source and drainelectrode are formed with the insulating film covering the gateelectrode therebetween.
 39. A semiconductor element according to claim37, wherein the insulating film covering the gate electrode comprises aninsulating film that is formed over the gate electrode and an insulatingfilm that is formed in a side face of the gate electrode.
 40. Asemiconductor element according to claim 38, wherein the insulating filmcovering the gate electrode comprises an insulating film that is formedover the gate electrode and an insulating film that is formed in a sideface of the gate electrode.
 41. A semiconductor element according toclaim 37, wherein the insulating film that is formed over the gateelectrode is a hard mask and the insulating film that is formed in aside face of the gate electrode is a sidewall.
 42. A semiconductorelement according to claim 38, wherein the insulating film that isformed over the gate electrode is a hard mask and the insulating filmthat is formed in a side face of the gate electrode is a sidewall.
 43. Asemiconductor element according to claim 37, wherein the semiconductorregion is a semiconductor substrate or a semiconductor thin film.
 44. Asemiconductor element according to claim 38, wherein the semiconductorregion is a semiconductor substrate or a semiconductor thin film.
 45. Asemiconductor element according to claim 43, wherein the semiconductorsubstrate is a single crystal silicon substrate or a compoundsemiconductor substrate.
 46. A semiconductor element according to claim44, wherein the semiconductor substrate is a single crystal siliconsubstrate or a compound semiconductor substrate.
 47. A semiconductorelement according to claim 43, wherein the semiconductor thin film is acrystalline silicon film.
 48. A semiconductor element according to claim44, wherein the semiconductor thin film is a crystalline silicon film.49. A method for manufacturing a semiconductor device having a methodfor manufacturing a semiconductor element according to claim
 1. 50. Amethod for manufacturing a semiconductor device having a method formanufacturing a semiconductor element according to claim
 2. 51. A methodfor manufacturing a semiconductor device having a method formanufacturing a semiconductor element according to claim
 3. 52. A methodfor manufacturing a semiconductor device having a method formanufacturing a semiconductor element according to claim
 4. 53. A methodfor manufacturing a semiconductor device having a method formanufacturing a semiconductor element according to claim
 5. 54. A methodfor manufacturing a semiconductor device having a method formanufacturing a semiconductor element according to claim
 6. 55. Asemiconductor device comprising a semiconductor element formed accordingto claim
 37. 56. A semiconductor device comprising a semiconductorelement formed according to claim 38.